SiPh Wafer Level Test System

Function
‧TX FA Coupling
‧TX FA Align with PIC
‧Fixed the FA after Coupling by UV Glue (Include Glue Fixed and UV Curing)

Key Point
‧RSSI ADC
‧High-Precision Stage to Align X/Y/Z Plane
‧Online Monitoring and Data Uploading to Database

SKU: SiPh Wafer Level Test System

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Update：2025.04.10

Station details

Station	Function	Key Point
SiPh Chip Tester	‧SiPh Chip Design Verification ‧Academic and Laboratory Research ‧Mass Production Testing and Quality Control	‧High-Reliability Nanometer-Scale Alignment Precision ‧Semi-Automated Optical Coupling and Alignment Testing ‧Multiple measurement capabilities for O-O, O-E, E-O, and E-E device configuration

Major equipment

Equipment	Key Parameter
Fine Positioning	‧X/Y/Z Resolution: 2nm ‧X/Y/Z Repeatability: 5nm

Specification Sheet

Type	Item	Parameter
Equipment Dimensions & Power	Power Input	220V 50/60Hz
	Pneumatic System	Compressed air flow >500PM; System supply pressure 0.6MPa-0.7MPa
	Vacuum System	Vacuum gauge reading -53 ~ -100kPa
	Environmental Conditions	Temperature: 15-35°C; Humidity: standard 60% at 22°C; Cleanliness level: 10k Class
	Machine Dimensions	1660mm×1610mm×1550mm
	Equipment Weight	1500kg
Safety Protection	Product Safety Protection	Contact grounding treatment
	ESD Protection	Ion fan for electrostatic removal
	Software Protection	Mistake proofing
	Equipment Protection	Collision prevention, axis stroke limit, distance sensor
	Operator Safety Protection	Protective goggles
Motion and Positioning Systems (coarse positioning)	Operating module	Dual 6 axis module
	Workpiece Clamping	Electric clamp, vacuum suction fixation
	Repeatability XYZ Drive Mechanism	±0.05μm Step motor with ball screw
	XYZ motion stroke	±15mm
	Maximum movement speed	15mm/s
Motion and Positioning Systems (fine positioning)	Control axis	XYZ axis
	Resolution	2nm
	Bi-directional repeatability (10% movement range)	5nm
Alignment System	Scan time - spiral area 10 µm	<0.5s
	Scan time - gradient ±5 µm	<0.3s
	Repeatability	0.02dB
Z-axis Sensing System	Sensing range	2.4mm
Z-axis Sensing System	Resolution	24nm
Microscope Movement System	Travel Distance	XY axis 50mm; Z axis 127mm
	Resolution	1μm
	Repeatability	±3μm
Probe Station System (XYZ platform)	Travel Distance	X axis 350mm; Y axis 365mm; Z axis 20mm
	Resolution	0.1μm
	Repeatability	±1μm
	Accuracy	±2μm
Probe Station System (Theta platform)	Travel Distance	±10°
	Resolution	0.0001°
	Repeatability	0.0005°
	Accuracy	0.001°
Wafer chuck	Diameter	310mm
	Surface flatness	±10μm
	Test object size capability	single DUT ,2 ,4, 6 ,8 ,12 inch
Temperature control system	Temperature controllable range	Recommended operating range -40°C to 100°C, Extended Maximum Temperature Up to 300°C
Temperature control system	Heating and cooling rate	Heating: -40°C to 25°C < 30 min; 25°C to 300°C < 50 min Cooling: 300°C to 25°C < 60min; 25°C to -40°C <60 min

SiPh Wafer Level Test System

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